Semiconductor Engineering

Choosing The Right Memory Solution For AI Accelerators

To meet the increasing demands of AI workloads, memory solutions must deliver ever-increasing performance in bandwidth, capacity, and efficiency. From the training of massive large language models ...
Electronic Design

HBM4 and SPHBM4: Scaling Memory Bandwidth for AI and HPC

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...
Semiconductor Engineering

HBM4E Raises The Bar For AI Memory Bandwidth

The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...

More expensive phones, PCs: How consumers are paying for the AI boom

The cost of memory as a percentage of the total cost of a low-end phone has surged from under 10% to over 40% now. Like ...
Business Wire

JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC

ARLINGTON, Va.--(BUSINESS WIRE)--JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of its ...
Business Wire

Kioxia Achieves Successful Prototyping of 5TB Large-Capacity and 64GB/s High-Bandwidth Flash Memory Module

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, has successfully developed a prototype of a large-capacity, high-bandwidth flash memory module essential for large-scale ...